Industrial Computed Tomography
The area of Industrial Computed Tomography focuses on the most advanced aspects related to industrial applications of x-ray computed tomography, including geometrical metrology, product development, process optimization and failure analysis. The research activities are carried out in close collaboration with manufacturing companies, technology providers and international research centres. Availability of state-of-the-art equipment as well as close integration with other research areas in the precision- and micro-manufacture domain provide a sound scientific and industrial value to the innovative research approaches developed in this framework.
Current research lines focus on:
- advanced metrology of freeform shapes, including internal geometries and assemblies;
- development of methods for ensuring accurate and traceable CT dimensional measurements;
- advanced methods for product development, failure analysis and reverse engineering;
- CT-based process optimization for precision- and micro-manufacturing;
- development of specific quality control procedures for additive manufacturing;
- development of innovative methods for wear volumes quantification and for sub-surface damage investigation;
- study of composite materials and multi-material products;
- pre-normative research on metrological performance verification and uncertainty determination;
- co-ordination of round-robin tests for comparison of metrological CT systems;
- advanced training of experts on advanced quality control by computed tomography.
Metrological X-ray Computed Tomography system (CT)
- X-ray source: 225kV / 225W
- X-ray spot: 3 μm micro-focus
- Detector: 16 bit, 2000x2000 pixel
- Temperature controlled enclosure
- Magnification: 1.6x to 150x
- Max sample size: D = 250 mm, h = 450 mm
Scanning Electron Microscopy (SEM)
The Scanning Electron Microscopy (SEM) allows the determination the chemical composition and structure of the materials, through high energy electron beam in a vacuum. The beam-specimen interaction generates various signals that are acquired by appropriate detectors and subsequently processed to form an image. Magnification range from 6 up to 100'000x.
Accessories: Energy Dispersive X-Ray Analysis (EDS), Environmental Scanning Electron Microscope (ESEM), Electron Backscatter Diffraction (EBSD), heating chamber, up to 1500°C, for analyses at high temperature.