Surface, Geometrical and Industrial Metrology
The general aim is to do research on methods and techniques for the full geometrical characterisation of manufactured parts, prototypes, dies and tools. The scale of interest ranges from nanometers (surface metrology, metrology of microparts) to several meters (large scale metrology), embracing the most relevant applications for current and future industrial needs of manufacturing. The areas of advanced coordinate metrology and surface characterisation have been defined as the main research areas of the laboratory. CAD-based inspection, reverse engineering, calibration and verification procedures, metrology of freeform surfaces and complex parts are core competences within coordinate metrology. Research efforts currently focus on non-contact metrology and on the metrology of microparts.
Examples of current research lines are:
- coordinate metrology of complex and freeform shapes;
- multi-sensor and non-contact measuring techniques;
- advanced surface characterization;
- end-scale dimensional metrology;
- optical systems for in-line quality control at elevated temperature;
- economic impact of metrology in manufacturing.
3D optical profilometer
The profilometer allows the topological surface analysis thanks to the possibility to obtain fast, non-invasive measurements of micro and nano-geometries surfaces in multiple configurations. This tool uses a black and white, high speed, high resolution CCD camera as the system metrological detector, and a colour camera for bright field surface inspection that can be used to create 3D views of the measurements.
Machine characteristics: Step Height Repeatability 0.1%, Roughness Repeatability < 0.2% and Step Height Accuracy about 0.5%. Objectives: 2,5x - 5x - 20x - 100x, motorized table and dampener.
Scanning Electron Microscopy (SEM)
The Scanning Electron Microscopy (SEM) allows the determination the chemical composition and structure of the materials, through high energy electron beam in a vacuum. The beam-specimen interaction generates various signals that are acquired by appropriate detectors and subsequently processed to form an image. Magnification range from 6 up to 100'000x.
Accessories: Energy Dispersive X-Ray Analysis (EDS), Environmental Scanning Electron Microscope (ESEM), Electron Backscatter Diffraction (EBSD), heating chamber, up to 1500°C, for analyses at high temperature.
Visiting full professor
Technical University of Denmark